https://www.esionpcba.com/12-layer-pcb-dedicated-to-800g-qsfp-dd-osfp.html
For high-speed optical interconnection, PCB performance has a direct impact on signal integrity and transmission stability. This 12-layer PCB is designed specifically for 800G QSFP-DD/OSFP optical modules, using the Talyo FR4-TU933+ ultra-low-loss substrate to address challenges such as high-speed signal attenuation and crosstalk.
The TU933+ substrate has a Dk of 3.16@10GHz and a Df of 0.0021@10GHz. Combined with a 12-layer symmetric lamination structure, the PCB covers a bandwidth of DC-53GHz, supports 112Gbps PAM4 transmission, and enables 8 × 100G transmission.
The PCB also uses advanced processes such as 2nd-order HDI and LDI, together with 7% impedance control and ENEPIG surface treatment. These features allow it to adapt to COB/BOX packaging and provide stable support for optical interconnection applications in data centers, AI computing clusters, and cloud computing.
For 800G optical module applications, this 12-layer PCB combines a low-loss substrate, high-speed transmission capability, symmetric lamination, and advanced PCB manufacturing processes to support demanding high-speed interconnection requirements.
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Shenzhen EsionPCBA Technology Co., Ltd.
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